COCONUT SHELL-WOOD RESIN COMPOSITE AS INSULATING SUBSTRATE

Junius Andre F. Balista, Patrick Joseph Clement T. Bellora, Gerard S. Cabunducan, Paolo Vanni M. Venegas (March 2000)

Philippine Science High School Western Visayas Campus – Department of Science and Technology (DOST-PSHS WVC), Brgy. Bito-on, Jaro, Iloilo City 5000, Philippines

ABSTRACT

The study was conducted to determine the feasibility of producing coconut shell – wood resin composite as insulating substrate of circuit board. These insulating substrate were prepared in three different mixtures, i.e., (30%-70%), (40%-60%) and (50%-50%) coconut shell and wood resin. These mixtures were further mixed with water with constant ratio by weight of 70% coconut shell-wood resin mixture to 30% water. The products were tested on water resistance, etchant resistance, insulation resistance, and flammability.

Result showed that insulating substrate from coconut shell-wood resin composite was feasible. The products resisted water infiltration of mean amounts ranging from 86.64% to 90.70%. The products resisted etchant infiltration of mean amounts ranging from 81.88% to 91.35%. All of the products had high electrical resistance as reflected in the infinity readings from the ohmmeter. All of the products were not flammable.

There was a significant difference in the water resistance, etchant resistance and flammability of the insulating substrates.

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